In addition, sustainable development is an important consideration factor for future integrated circuit chip packaging.
Automated packaging lines can also achieve automated management and optimization of the production process through intelligent control systems,
Product features: Fast switch, low on resistance, low gate charge, 100% single pulse avalanche energy test
Product features: Ultra low RDS (ON), low gate charge, high current capability, 100% UIS test, 100% Rg test
Product features:Ultra low RDS (ON), low gate charge, high current capability, 100% UIS test, 100% Rg test
